WestBond, Inc.
UltrasonicEngineering Co.,Ltd.
TPT Wire Bonder
SHIBUYA CORPORATION
Questar Products International, Inc.
Palomar Technologies
Minder-Hightech Co.,ltd
Micro Point Pro Ltd
Kulicke and Soffa Industries, Inc.
KAIJO corporation
Hesse
F&S Bondtec Austria

15 Wire Bonder Manufacturers in 2024

This section provides an overview for wire bonders as well as their applications and principles. Also, please take a look at the list of 15 wire bonder manufacturers and their company rankings. Here are the top-ranked wire bonder companies as of March, 2024: 1.Questar Products International, Inc., 2.KAIJO corporation, 3.Anza.

Table of Contents

List of 15 Wire Bonder Manufacturers

*Including some distributors, etc.

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  • Company Size: largest first
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  • United States of America
  • Austria
  • China
  • Germany
  • Israel
  • Japan
  • Taiwan
    • Questar Products International, Inc.
      • United States of America Address: 1807H Santa Rita Road #270, Pleasanton, California, United States of America

      Manufacturer Overview

      Questar Products International, Inc., Founded in 1983, was establishedas a manufacturer specialized industry machinery. The company is headquartered in Pleasanton, CA, where it strategically operates to provide performance-oriented packaging services tailored to the waste industry. Questar's comprehensive offerings encompass a range of solutions, including rated containers, drums, pails, and totes, all designed to address diverse waste packaging needs. With a strong urge to meeting packaging requirements, Questar Products International is directed to serving enterprises seeking efficient and effective packaging solutions.

    • Palomar Technologies
      • United States of America Address: 6305 El Camino Real, Carlsbad, California, United States of America

      Manufacturer Overview

      Palomar Technologies, Inc., Established in 1975, is a manufacturer of precision automation equipment specializing in microelectronics assembly and packaging solutions. The company offers a range of products, including die attach solutions, wire bonding equipment, and optoelectronic packaging systems. With a global captivity, Palomar Technologies has solidified its position as a key player in the industry, providing cutting-edge technology for various applications. the company's Wide range of products has made them a preferred choice among those seeking advanced assembly solutions.

    • WestBond, Inc.
      • United States of America Address: 1551 S. Harris Court, Anaheim, California, United States of America

      Manufacturer Overview

      WestBond, Inc. was founded in 1966 and is based in Dunn, North Carolina as a manufacturer of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry. Since its inception, the company has specialized in manufacturing quality semiconductor wire bonders, die bonders, wedge bonders, and related equipment. The company's expertise also extends to wire pull and shear test equipment, ultrasonic components, and various accessories. WestBond serves customers both domestically and internationally.

    • SHIBUYA CORPORATION
      • Japan Address: Ko-58 Mameda-Honmachi, Kanazawa, Ishikawa, Japan

      Manufacturer Overview

      Shibuya Corporation, founded in 1931, is a Japan-based manufacturer and retailer of industrial systems and equipment. Their product portfolio is available in various categories, including packaging plant business, mechatronics, agricultural and regenerative medicine. The packaging plant segment includes various equipment and systems used in the bottling, packaging, food processing and pharmaceutical industries. The agricultural division includes grading & analyzing systems such as fruit, welsh onion, and flowering plant grading systems. The mechatronics system segment includes medical equipment such as dialysis systems, medical lasers, and UV Light treatment systems. The division also includes semiconductor manufacturing and cutting processing systems.

    • Minder-Hightech Co.,ltd
      • China Address: Room 209-210,Building 2, No31,Bangjiang East village , Shilian Road, Dalong street, Panyu, China

      Manufacturer Overview

      Minder-Hightech Co.,ltd, established in 2014 and headquartered in Guangzhou, China, emerged as a manufacturer specializing in automation solutions. Its product portfolio encompasses automatic soldering machines, dispensing robots, and screw fastening machines, serving industries such as electronics, automotive, medical, consumer goods, and packaging. Its products are designed to streamline manufacturing processes including soldering, dispensing adhesives, and screw fastening. The machining workshop features lathes, grinders, wire cutting, drilling machines, and more, offering fixture design, production, and sample services.

    • KAIJO corporation
      • Japan Address: 3-1-5, Sakae-cho, Hamura-shi, Tokyo, Japan

      Manufacturer Overview

      Kaijo Corporation is a manufacturer of industrial cleaners that originated from Kaijo, Japan. The company started as a maker of fish finders and echo sounders and in 1957, they started manufacturing their first ultrasonic cleaners. They now have two lines of ultrasonic cleaning equipment and systems as well as a range of specialty products and applications. Their main office is located in Tokyo, Japan, with four international offices in China, Taiwan, the United States, and Germany.

    • TPT Wire Bonder
      • Germany Address: Einsteinstraße 10, Karlsfeld, Munich, Bavaria, Germany

      Manufacturer Overview

      TPT Wire Bonder, established 1996, is a manufacturer of wire bonders and die bonders in the field of wire bonding technology. The company specializes in the development and production of semi-automatic wire bonders, catering to the microelectronics sector. With a wealth of experience in wire bonding and die bonding technology, TPT Wire Bonder GmbH and Co. KG offering both manual and semi-automatic wire bonding machines since its establishment. The company's advancing microelectronics applications makes them a good partner for those seeking wire bonding solutions.

    • Kulicke and Soffa Industries, Inc.
      • Taiwan Address: 10-1F, No.21, Section 6, Zhongxiao East Road, Nangang District, Taipei City, Taiwan

      Manufacturer Overview

      Kulicke and Soffa Industries, Inc., founded in Philadelphia, Pennsylvania, in 1951 is a manufacturer of semiconductor and electronics assembly solutions. The company's product portfolio includes advanced Packaging (Hybrid), Ball Bonders, Die Attaches, Electronics Assemblies and Wafer Level Bonders. Their products are used in markets such as automotive, communications, computer, consumer, and data storage. The company provides services such as Product Selection Guidance, Engineering Support, New Product Design and Development and Custom Manufacturing.

    • F & K DELVOTEC Bondtechnik
      • Germany Address: Daimlerstr. 5 Ottobrunn, Bayern, Germany

      Manufacturer Overview

      F & K DELVOTEC Bondtechnik GmbH, founded in 1978, is a manufacturer headquartered in Ottobrunn, Germany, specializing in assembly and joining technologies for semiconductor and microelectronics manufacturing. F & K DELVOTEC develops technology and solutions for manual, partial, and full automation of wire bonding. The company also provides services covering machine selection and configuration, buffer station and magazine coupling, as well as feeding system integration for various industries, including the semiconductor, automotive, and photovoltaic sectors. Recognizing the growing demand for power electronics, the company also develops laser bonding technology to join aluminum and copper ribbons on direct copper bonding (DCB) substrates.

    • Micro Point Pro Ltd
      • Israel Address: HaTnufa St 5, Yokne’am Ellit, Israel

      Manufacturer Overview

      Micro Point Pro Ltd, founded in 2010 and formerly the micro-swiss wedge and die attach tool division of Kulicke and Soffa Industries, Inc. (K&S), is a manufacturer based in Yokne'am Illit, Israel, specializing in the front-end and back-end of semiconductor manufacturing. In 2016, MPP acquired K&S's manual wire bonder division, enabling the company to become an Original Equipment Manufacturer (OEM) of manual wire bonders. MPP provides probe head technology for resistivity tests on wafers, along with high-precision expendable tools for packaging processes in the microelectronic industry. The company’s tools and solutions find application in the medical, aerospace, and semiconductor sectors.

    • Hesse
      • Germany Address: Lise-Meitner-Str. 5, Paderborn, Nordrhein-Westfalen, Germany

      Manufacturer Overview

      Hesse GmbH, established in 1995 and headquartered in Paderborn, Germany, is a global manufacturer specializing in fully automatic ultrasonic bonding and welding machines as well as laser welding systems, software for monitoring ultrasonic-bond-processes and customized tools and machines. The company offers various products, including fine wire bonding, heavy wire bonding, and thermosonic wire bonding with subsidiaries in Hong Kong, USA and Japan. The company serves industrial companies engaged in assembly and connection technology, including semiconductor manufacturers, HF/RF, automotive, battery systems suppliers, and medical.

    • UltrasonicEngineering Co.,Ltd.

      Manufacturer Overview

      Ultrasonic Engineering Co.,Ltd., founded in 1956 and based in Tokyo, Japan, is a manufacturer of electrical equipment, machinery, and supplies among others. The company has 186 patents and offers a wide range of products including cltrasonic wire bonders, ultrasonic cleaners, ultrasonic plastic welders, ultrasonic metal bonders, and ultrasonic measuring instruments among others. The company serves various industries including chemicals & pharmaceuticals, paper & printing, transport & logistics, textiles, and many more.

    • DIAS Automation
      • China Address: Unit A7-A8, 3/F, Merit Industrial Building, 94 Tokwawan Road, Kowloon, Hong Kong, China

      Company Overview

      DIAS Automation, Established between 1990s to 2000s, to excel as a manufacturer and supplier, specializes in servicing automation equipment for the semiconductor and electronics industries. With streamlining processes, the company delivers cutting-edge automation technologies to enhance efficiency across industries. DIAS Automation's automation is evident through its comprehensive range of automation products and services, designed to meet diverse operational needs. With a customer-centric approach, the company's solutions cater to businesses seeking to optimize its operations through advanced automation.

    • F&S Bondtec Austria
      • Austria Address: Industriezeile 49a, Braunau, Oberösterreich, Austria

      Company Overview

      FandS Bondtec Austria, Founded in 1994 by Dr. F. Farassat and Dipl. Ing. S. Kazemi, is a key manufacturer and supplier in the wirebonding industry. The company traces its roots to the expertise of its founders, boasting a collective experience of over a century. Originally established with wirebonding specialists from the AEG-Telefunken production facility, the company has grown to become a name in the field. The company's Austria target on wirebond processes and technology positions it as a pioneer in the semiconductor and electronic component manufacturing domain.

    • Company Overview

      ANZA Inc, Established in 1980, offers its services as a manufacturer, supplier, or distributor in the Financial Services industry, based in Watertown, South Dakota. With its operational headquarters situated in this region, ANZA Inc employs a workforce of 251-500 individuals and boasts revenue ranging from $50 million to $100 million. The company's significant mark in the financial sector is reflected in its consistent performance. ANZA Inc's offerings adds up to this industry's growth, serving as a paartner to financial solutions and services.

Wire Bonder Manufacturer Ranking

*Including some distributors, etc.

Derivation Method

The ranking is calculated based on the click share within the wire bonder page as of March 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.

Number of Employees

  1. SHIBUYA CORPORATION: 3,635
  2. KAIJO corporation: 240

Newly Established Company

  1. Micro Point Pro Ltd: 2010 (14 years ago)
  2. TPT Wire Bonder: 1996 (28 years ago)
  3. Palomar Technologies: 1995 (29 years ago)

Company with a History

  1. SHIBUYA CORPORATION: 1931 (93 years ago)
  2. KAIJO corporation: 1948 (76 years ago)
  3. Kulicke and Soffa Industries, Inc.: 1951 (73 years ago)

Wire Bonder Manufacturers in United States

*Including some distributors, etc.

Global Distribution of Wire Bonder Manufacturers by Country

*Including some distributors, etc.

Country Number of Companies Share (%)
United States of America United States of America 3 23.1%
Germany Germany 3 23.1%
Japan Japan 2 15.4%
China China 2 15.4%
Taiwan Taiwan 1 7.7%
Israel Israel 1 7.7%
Austria Austria 1 7.7%

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